Typical application
• Semiconductors
• Microelectronic technology
• Medical and pharmaceutical
• Chemical industry
• power station
• General industry
Features & Benifits
• Continuous and stable high quality product
• Full filled resin effectively improves the stability of product.
• Proprietary ion exchange membrane technology could effectively reduces power and energy consumption. It’s a • low carbon green technology
• Continuous operation without leakage at 7bar (100psi)
• Special electrical wiring design, quick installation, easy maintenance and excellent insulation performance
• Double O-ring seal could ensure that no leakage occurs during operation
• Reliable stack rebuild service, flexible and worry-free warranty policy
• Standard detection processes, product warranty of time and performance
Quality Assurance
- 100% membrane pre-delivery inspection
The typical flow diagram
Data sheet
| Maximum feed water specifications | |
|---|---|
| Total exchangeable anions (TEA as CaCO3) | <25mg/L |
| Silicon dioxide | <1.0ppm |
| Iron, manganese, sulfide | <0.01ppm |
| Total chlorine(as Cl2) | <0.02ppm |
| Total hardness( as CaCO3) | <1ppm |
| Grease | Non-detected |
| TOC | <0.5ppm |
| SDI 15 | <1 |
| Oxidizing agent | Non-detected |
| Turbidity | <0.1NTU |
| Chroma | <5.0APHA |
| Operating PH | 6-9 |
| Operating temperature | 5-45℃ |
| Inlet Pressure | ≤7 bar |
| Operating parameters | |
|---|---|
| Current(A) | <5 |
| Operating pressure(bar) | 2.8-5.0 |
| Standard pressure drop(bar) | 1.4-2.8 |
| Recovery | 90-95% |
| Product resistivity | ＞16MOhm-cm |
| Silicon removal rate | Up to 99%(Depends on the feed conditions) |
| Boron removal rate | ＞95%(Depends on the feed conditions) |
| Xpure Stack specifications | ||||||
|---|---|---|---|---|---|---|
| Model | MINI | KLEIN-A | KLEIN-B | STD | GROTE | ENO |
| Nominal flow(m³/h） | 0.5 | 1.0 | 2 | 3.8 | 5.6 | 7.0 |
| Flow rate range(m³/h） | 0.3-0.65 | 0.7-1.6 | 1.3-3.0 | 1.7-4.5 | 2.6-6.8 | 4.2-9.1 |
| Voltage (VDC) | 0-55 | 0-135 | 0-240 | 0-300 | 0-400 | 0-600 |
The information provided in this brochure is only for general descriptions and product features. The contents may be different from the actual application. The brochure will be updated with further development of the product.